Shop by Category
Panasonic HG-C Series - Small Laser Measurement Sensors
Reliable detection as good as 10 µm resolution in compact body
With a compact size of just W20 x H44 x D25 mm the HG-C Series sensor provides high-end performance in a small, lightweight package. Five measurement ranges (400mm±200, 200mm±80, 100mm±35, 50mm±15, and 30mm±5) are available with a measurement resolution ranging from 10 µm to 300 µm depending on the model selected. The built-in display assists in setup and operation, and I/O options include a 0-5V or 4-20ma analog output alongside either one NPN or PNP transistor output as well as an external input. IO Link versions now Available!



Overwhelmingly stable
The HG-C Series is fitted with a precise CMOS image sensor and original algorithm making it possible to perform highly precise measurements in the order of 1/100mm.

New and improved optical system
A built-in mirror allows for more accurate and stable measurements to be achieved by increasing the optical path and providing smaller sensor depth.

Strain and heat protected
The strong-but-lightweight aluminum die-cast casing protects the unit from the impact of strain and heat on measurement accuracy.

Analog outputs
The HG-C Series is equipped with 0 to +5 V analog output and 4 to 20 mA analog current output. Various calculations and storage can be performed when output is taken into a PLC + analog unit.

Applications
.jpg)
Measuring the hoop slack
.jpg)
Measuring the insertion depth of an actuator
.jpg)
Measuring the thickness of a panel
.jpg)
Measuring the thickness of a part
.jpg)
Controlling the dispenser head height
.jpg)
Controlling the mounter head height
.jpg)
Controlling the parallel link robot height
.jpg)
Install able on a food packaging line where water splashes
.jpg)
Detecting on-vehicle seats
.jpg)
Judging front or back of cover of cast parts
.jpg)
Measurement of a remaining functional sheet
.jpg)
Detecting parts through a viewing port
.jpg)
Detecting warpage of a circuit board

Checking for overlapped lead frames

Checking for presence of packing

Judging front or back of cover of electric parts

Detecting a seam (overlap) of functional sheet